The Advanced Photon Source (APS) now has a total of 23 insertion devices (IDs). Over two-thirds of them are installed on the storage ring. The installed devices include 18, 27 and 55 mm-period undulators; an 85 mm-period wiggler; a 16 cm-period elliptical multipole wiggler; and many 33 mm-period undulators. Most of the IDs occupy storage-ring straight sections equipped with 8 mm vertical-aperture vacuum chambers. All of the IDs were measured magnetically at the APS and, in most cases, underwent a final magnetic tuning in order to minimize variation in the various integrals of the field through the ID over the full gap range. Special shimming techniques to correct magnetic field parameters in appropriate gap-dependent ways were developed and applied. Measurements of the closed-orbit distortion as a function of the ID gap variation have been completed, and results are in a good agreement with magnetic measurements. Spectral diagnostics of the ID radiation, including measurements of the absolute spectral flux, brilliance and polarization, show excellent agreement between calculated and measured results. Studies of the sensitivity of IDs to radiation exposure and measurements of the dose rate received by the IDs are in progress.
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http://dx.doi.org/10.1107/S0909049597013769 | DOI Listing |
Br J Nurs
January 2025
Postgraduate Program in Nursing, Nursing Department, Health Sciences Centre, Universidade Federal de Santa Catarina, Florianopolis, Brazil.
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View Article and Find Full Text PDFJ Shoulder Elbow Surg
January 2025
Roth | McFarlane Hand & Upper Limb Center, St Joseph's Health Care London, London, ON, Canada.
Background: Precise and accurate glenoid preparation is important for the success of shoulder arthroplasty. Despite advancements in preoperative planning software and enabling technologies, most surgeons execute the procedure manually. Patient-specific instrumentation (PSI) facilitates accurate glenoid guide pin placement for cannulated reaming; however, few commercially available systems offer depth of reaming control.
View Article and Find Full Text PDFMicromachines (Basel)
December 2024
Center of Excellence for Thin-Film Research and Surface Engineering (CETRASE), Department of Electrical and Computer Engineering, University of Dayton, Dayton, OH 45469, USA.
This paper explores the potential of phase change materials (PCM) for dynamically tuning the frequency response of a dumbbell u-slot defected ground structure (DGS)-based band stop filter. The DGSs are designed using co-planar waveguide (CPW) line structure on top of a barium strontium titanate (BaSrTiO) (BST) thin film. BST film is used as the high-dielectric material for the planar DGS.
View Article and Find Full Text PDFMicromachines (Basel)
December 2024
School of Physics, University of Electronic Science and Technology of China, Chengdu 611731, China.
With the emergence of the Internet of Things (IoT), the demand on the wireless power supply to consumer electronics simultaneously requires much more location freedom, ease of use, and performance with wireless communications. In this paper, an unenclosed quasi-static cavity resonator (QSCR) constructed with metallic strips and the design method are proposed and theoretically analyzed. This unenclosed QSCR has a simple structure, which benefits the wireless charging for portable/wearable electronics and smart appliances in the office and home environment.
View Article and Find Full Text PDFMicromachines (Basel)
December 2024
Department of Foundry Engineering, Dankook University, Yongin 16890, Republic of Korea.
This paper presents a novel approach to fabricate substrate integrated waveguides (SIWs) on glass substrates with tin (Sn) through glass vias (TGVs) tailored for millimeter-wave applications. The fabrication process employs a custom-designed vacuum suctioning system to rapidly fill precise TGV holes in the glass substrate, which are formed by wafer-level glass reflow micromachining techniques with molten tin in a minute. This method offers a very fast and cost-effective alternative for complete via filling without voids compared to the conventional metallization techniques such as electroplating or sputtering.
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