YOLOv8-DEE: a high-precision model for printed circuit board defect detection.

Defects in printed circuit boards (PCBs) occurring during the production process of consumer electronic products can have a substantial impact on product quality, compromising both stability and reliability. Despite considerable efforts in PCB defect inspection, current detection models struggle with accuracy due to complex backgrounds and multi-scale characteristics of PCB defects. This article introduces a novel network, YOLOv8-DSC-EMA-EIoU (YOLOv8-DEE), to address these challenges by enhancing the YOLOv8-L model.

Effect of heat shield locations on rework-induced thermal management in ball grid array solder joint.

This study investigated the effectiveness of heat shield placement locations during the rework process to avoid thermal and mechanical damage to adjacent ball grid array components and their solder joints on double-sided printed circuit board assembly. Three types of heat shield placement locations were used: sample X, individual heat shield placement on adjacent components of the rework location; sample Y, a U-shaped, and sample Z, a square-shaped heat shield placed respectively at the heat source location. The dye and pull test results, infrared thermography, and temperature measurements were analysed to understand the relationship between the location of the heat shield and solder joint damage during rework.