Study on aluminum nitride/addition-cure liquid silicone rubber composite for high-voltage power encapsulation.

In view of the development direction of high power and miniaturization of high-voltage power supply, higher requirements are put forward for the breakdown strength, thermal conductivity of packaging materials for its high voltage output module. An electric-insulated heat-conducted material with aluminium nitride as heat conducting filler and addition-cure liquid silicone rubber (ALSR) as matrix for high voltage power encapsulation has been studied. Initially, the thermal conductivity and breakdown strength of composites were explored at different filler fractions.