Thermal Conductive Encapsulation Enables Stable High-Power Perovskite-Converted Light-Emitting Diodes.

Significant progress has been achieved on perovskite nanocrystal (PNC)-converted light-emitting diodes (PcLEDs) with the development of surface encapsulations. However, achieving bright and long-living devices remains a challenge because the thermal isolation structure of the air barriers exacerbates heat accumulation inside PcLEDs. Here, we proposed a thermal conductive encapsulation for PNCs by embedding CsPbBr PNCs in layer-by-layer assembled boron nitride (BN) nanoplatelets through SiO crosslinking.

Solvent- and initiator-free fabrication of efficient and stable perovskite-polystyrene surface-patterned thin films for LED backlights.

We report a one-pot route for the synthesis of CsPbBr perovskite nanocrystals (PNCs) in styrene to form a glue-like polystyrene (PS) pre-polymer incorporating mono-dispersed PNCs. The pre-polymer enables solvent- and initiator-free fabricating and patterning PNC-PS light down-conversion films for liquid crystal display application. The mechanistic study reveals that the styrene molecules adsorbed on the PNC surface undergo self-initiated polymerization in the pre-polymerization process, forming stable surface capsulation over the PNCs.