Publications by authors named "Zhijie Gu"

The development of front-side pastes suitable for devices with high sheet resistance such as tunnel oxide passivated contact (TOPCon), is of great significance but remains a considerable challenge. The optimization of the Ag-Si contact interface is crucial for enhancing contact and improving the efficiency of these devices. This work investigates the front-side Ag pastes with low Al content (<2 wt.

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RORγt group 3 innate lymphoid cells (ILC3s) are essential for intestinal homeostasis. Dysregulation of ILC3s has been found in the gut of patients with inflammatory bowel disease and colorectal cancer, yet the specific mechanisms still require more investigation. Here we observe increased β-catenin in intestinal ILC3s from inflammatory bowel disease and colon cancer patients compared with healthy donors.

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Returning straw-like agricultural waste to the field by converting it into hydrochar through hydrothermal carbonization (HTC) is an important way to realize resource utilization of waste, soil improvement, and carbon sequestration. However, the large-scale HTC is highly limited by the large water consumption and waste liquid pollution. Here, we propose strategies to optimize the liquid-solid ratio (LSR) of HTC, and comprehensively evaluate the stability, soil application potential, and economic benefits of corn stover-based hydrochar under different LSRs.

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Polyester fibers are used in various fields, due to their excellent mechanical and chemical stability. However, the lack of conductivity limits their application potential. In order to prepare conductive polyester fibers, silver is one of the most widely used materials to coat the surface of the fibers.

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The generation of a flexible printed circuit board on polymer fabrics has been a challenge over the last decade. In this work, a copper pattern was obtained on a soft substrate of filter paper/polyacrylonitrile (FP/PAN) film, where the filter paper was commercially available. The pattern of Ag particles was first produced on an Ag⁺-doped FP/PAN composite film, followed by electroless plating of copper using the metal silver particles as seeds.

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