Mycoviruses are usually transmitted horizontally via hyphal anastomosis and vertically through sporulation in natural settings. Oyster mushroom spherical virus (OMSV) is a mycovirus that infects , with horizontal transmission via hyphal anastomosis. However, whether OMSV can be vertically transmitted is unclear.
View Article and Find Full Text PDFMetasurfaces demonstrate excellent capabilities in manipulating the phase, amplitude and polarization of light. Metalens, as a typical kind of metasurface devices, shows great prospect in simplifying imaging systems. However, like diffractive optical elements, intrinsic dispersion of metasurfaces is high.
View Article and Find Full Text PDFThe separation and recovery of palladium from electronic waste (e-waste) are of great significance as they can alleviate environmental pollution and avoid resource loss. Herein, a novel nanofiber modified by 8-hydroxyquinoline (8-HQ-Nanofiber) with adsorption sites co-constructed by N and O atoms of hard bases was fabricated, which has good affinity properties for the Pd(II) ions belonging to soft acid in the leachate of e-waste. The adsorption mechanism of 8-HQ-Nanofiber for Pd(II) ions was revealed from the perspective of molecular level relied on a series of characterizations, such as FT-IR, ss-NMR, Zeta potential, XPS, BET, SEM and DFT.
View Article and Find Full Text PDFVarious antireflective structures and methods are proposed to solve the optical loss of Si-based absorber devices. Dual-scale structures have received more concern from researchers in recent years. In this study, the finite difference time domain (FDTD) method is employed to investigate deeply the dependence of optical response on the geometric shape and size of structures.
View Article and Find Full Text PDFBlack silicon, which is an attractive material due to its optical properties, is prepared mainly by laser inducing in an SF atmosphere. Considering the effect of SF gas on the environment and human health, here we propose an efficient, economical, and green approach to process large-scale black silicon. In the wavelength range of 0.
View Article and Find Full Text PDFSiC wafers, due to their hardness and brittleness, suffer from a low feed rate and a high failure rate during the dicing process. In this study, a novel dual laser beam asynchronous dicing method (DBAD) is proposed to improve the cutting quality of SiC wafers, where a pulsed laser is firstly used to introduce several layers of micro-cracks inside the wafer, along the designed dicing line, then a continuous wave (CW) laser is used to generate thermal stress around cracks, and, finally, the wafer is separated. A finite-element (FE) model was applied to analyze the behavior of CW laser heating and the evolution of the thermal stress field.
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