Cu Pillar Electroplating Using a Synthetic Polyquaterntum Leveler and Its Coupling Effect on SAC305/Cu Solder Joint Voiding.

With the advancement of high-integration and high-density interconnection in chip manufacturing and packaging, Cu bumping technology in wafer- and panel- level packaging is developed to micrometer-sized structures and pitches to accommodate increased I/O numbers on high-end integrated circuits. Driven by this industrial demand, significant efforts have been dedicated to Cu electroplating techniques for improved pillar shape control and solder joint reliability, which substantially depend on additive formulations and electroplating parameters that regulate the growth morphology, crystal structure, and impurity incorporation in the process of electrodeposition. It is necessary to investigate the effect of an additive on Cu pillar electrodeposition, and to explore the Kirkendall voids formed during the reflowing process, which may result from the additive-induced impurity in the electrodeposited Cu pillars.

Bonding Behavior and Quality of Pressureless Ag Sintering on (111)-Oriented Nanotwinned Cu Substrate in Ambient Air.

(111)-oriented nanotwinned Cu ((111)nt-Cu) has shown its high surface diffusion rate and better oxidation resistance over common polycrystalline Cu (C-Cu). The application of (111)nt-Cu as an interface metallization layer in Ag-sintered technology under the role of oxygen was investigated in this work, and its connecting behavior was further clarified by comparing it with C-Cu. As the sintering temperature decreasing from 300 to 200 °C, the shear strength on the (111)nt-Cu substrate was still greater than 55 MPa after sintering for 10 min.

The function role of HIGD1A in nonalcoholic steatohepatitis from chronic hepatitis B.

Background: Accompanied by the growing prevalence of nonalcoholic fatty liver disease (NAFLD), the coexistence of chronic hepatitis B (CHB) and NAFLD has increased. In the context of CHB, there is limited understanding of the factors that influence the development of NASH.

Methods: We enrolled CHB combined NAFLD patients who had liver biopsy and divided them to NASH vs.

Research Progress of Electroplated Nanotwinned Copper in Microelectronic Packaging.

Copper is the most common interconnecting material in the field of microelectronic packaging, which is widely used in advanced electronic packaging technologies. However, with the trend of the miniaturization of electronic devices, the dimensions of interconnectors have decreased from hundreds of microns to tens of or even several microns, which has brought serious reliability issues. As a result, nanotwinned copper (nt-Cu) has been proposed as a potential candidate material and is being certified progressively.

Mucilage secretion by aerial roots in sorghum (Sorghum bicolor): sugar profile, genetic diversity, GWAS and transcriptomic analysis.

Aerial root mucilage can enhance nitrogen fixation by providing sugar and low oxygen environment to the rhizosphere microbiome in Sierra Mixe maize. Aerial root mucilage has long been documented in sorghum (Sorghum bicolor), but little is known about the biological significance, genotypic variation, and genetic regulation of this biological process. In the present study, we found that a large variation of mucilage secretion capacity existed in a sorghum panel consisting of 146 accessions.

Clinical Features of Non-Alcoholic Fatty Liver Disease in the Non-Lean Population.

Introduction: The prevalence of non-alcoholic fatty liver disease (NAFLD) in non-lean patients is significantly increased, and obesity significantly increases the risk of cirrhosis and HCC in NAFLD patients. However, whether there is a difference in clinical manifestations of NAFLD between overweight and obesity remains unclear. The objective of this study was to assess the clinical and histological features of NAFLD among a non-lean population.

Effect of sodium thiazolinyl dithiopropane sulphonate (SH110) addition on electroplating nanotwinned copper films and their filling performance of fine-pitch redistributed layer (RDL).

Nanotwinned copper is a potential microelectronic interconnection material due to its superior strength and conductivity, however, its filling ability is urgently needed to improve before its application in the field of advanced packaging. The effect of additive (sodium thiazolinyl dithiopropane sulphonate, SH110) addition on the surface roughness, microstructure, mechanical properties and filling capacity of nanotwinned copper films was investigated. The surface roughness and grain size were firstly reduced then increased with the increasing concentrations of SH110, reaching the minimum value at 10 ppm.

The identify role and molecular mechanism of the MALAT1/hsa-mir-20b-5p/TXNIP axis in liver inflammation caused by CHB in patients with chronic HBV infection complicated with NAFLD.

Background/aims: To identify the inflammatory damage caused by chronic hepatitis B (CHB) in patients of chronic hepatitis B virus (HBV) infection complicated with non-alcoholic fatty liver disease (NAFLD), then guiding clinicians to carry out antiviral treatment.

Methods: According to the pathological features of liver biopsy, treatment-naïve obese patients of chronic HBV infection complicated with NAFLD who had elevated alanine transaminase (ALT) were divided into CHB group and NASH group. Transcriptome chips were used to analyze the expression profiles of long non-coding RNA (lncRNA) and mRNA in liver puncture tissues from the two groups.

Clinical features of hepatitis B patients at immune-tolerance phase with basal core promoter and/or precore mutations.

Little data exist on basal core promoter/precore (BCP/PC) mutations in chronic hepatitis B (CHB) patients at the immune-tolerance (IT) phase. We studied consecutive treatment-naïve, CHBe-antigen (HBeAg)-positive patients who had undergone liver biopsy and genotyping. Those in the IT phase or immune-clearance (IC) phase were enrolled for comparison of the frequency of BCP/PC mutations and their clinical presentations.

Focused ion beam preparation of microbeams for in situ mechanical analysis of electroplated nanotwinned copper with probe type indenters.

A site-specific xenon plasma focused ion beam preparation technique for microcantilever samples (1-20 µm width and 1:10 aspect ratio) is presented. The novelty of the methodology is the use of a chunk lift-out onto a clean silicon wafer to facilitate easy access of a low-cost probe type indenter which provides bending force measurement. The lift-out method allows sufficient room for the indenter and a line of sight for the electron beam to enable displacement measurement.

Correlation between Myocardial Velocity Measured using Tissue Doppler Imaging in the Left Ventricular Lead-Implanted Segment and Response to Cardiac Resynchronization Therapy.

Objectives: This study investigated whether tissue Doppler imaging parameters, especially the peak systolic velocity of the left ventricular lead-implanted segment (Ss), affect cardiac resynchronization therapy response.

Methods: In this case-control study, 110 enrolled patients were divided into cases (responder group, n=65) and controls (nonresponder group, n=45) based on whether their left ventricular end-systolic volume was reduced by ≥15% at 6 months after surgery. Preoperative clinical and echocardiographic data were collected.

Reliability issues of lead-free solder joints in electronic devices.

Electronic products are evolving towards miniaturization, high integration, and multi-function, which undoubtedly puts forward higher requirements for the reliability of solder joints in electronic packaging. Approximately 70% of failure in electronic devices originates during the packaging process, mostly due to the failure of solder joints. With the improvement of environmental protection awareness, lead-free solder joints have become a hot issue in recent years.

Structure and properties of Sn-Cu lead-free solders in electronics packaging.

With the development of lead-free solders in electronic packaging, Sn-Cu lead-free solder has attracted wide attention due to its excellent comprehensive performance and low cost. In this article, we present recent developments in Sn-Cu lead-free solder alloys. From the microstructure and interfacial structure, the evolution law of the internal structure of solder alloy/solder joint was analysed, and the model and theory describing the formation/growth mechanism of interfacial IMC were introduced.

Highly Thermally Conducting Polymer-Based Films with Magnetic Field-Assisted Vertically Aligned Hexagonal Boron Nitride for Flexible Electronic Encapsulation.

Here, a facile, low-cost, and high-efficiency method to construct a vertically aligned hexagonal boron nitride nanosheet (hBNN) thermal conduction channel structure is proposed to improve the thermal conductivity. First, exfoliated negatively charged BNNs and positively charged FeCo nanocubes self-assemble to form complex nanomaterials by strong electrostatic interactions. Then, the BNNs can orient with FeCo nanocubes in magnetic field, and the {001} facets of BNNs adsorb on the {100} facets of FeCo nanocubes.

Highly Conductive Ag Paste for Recoverable Wiring and Reliable Bonding Used in Stretchable Electronics.

Stretchable wiring and stretchable bonding between a rigid chip/component and a stretchable substrate are two key factors for stretchable electronics. In this study, a highly conductive stretchable paste has been developed with commercial Ag microflakes and poly(dimethylsiloxane), which can be used to fabricate stretchable wirings and bondings under a low curing temperature of 100 °C with printing method. Herein, recoverabilities as to recovery time and recovery resistance of the wirings are defined and discussed.

Sweet Sorghum Originated through Selection of , a Plant-Specific NAC Transcription Factor Gene.

Sorghum () is the fifth most popular crop worldwide and a C model plant. Domesticated sorghum comes in many forms, including sweet cultivars with juicy stems and grain sorghum with dry, pithy stems at maturity. The locus, which controls the pithy/juicy stem trait, was discovered over a century ago.

Highly Stable Transparent Conductive Electrodes Based on Silver-Platinum Alloy-Walled Hollow Nanowires for Optoelectronic Devices.

In industrial manufacturing, alloying can contribute to the passivation of active metals and markedly improve their corrosion resistance. This inspires us to solve the current critical problem of Ag nanowires (Ag NWs) that have poor stability against chemical and electrochemical corrosion. These problems have seriously limited the applications of Ag NWs in optoelectronic devices where they are used for transparent conductive electrodes.

Molecular cloning, tissue expression and regulation of nutrition and temperature on Δ6 fatty acyl desaturase-like gene in the red claw crayfish (Cherax quadricarinatus).

Desaturase enzymes play an important role in the synthesis of unsaturated fatty acids. In this study, a complete cDNA sequence of a Δ6 desaturase-like gene was cloned from the hepatopancreas of the red claw crayfish, Cherax quadricarinatus. The full-length 1885 bp sequence comprises a 5' UTR of 254 bp, 3' UTR of 234 bp, and an open reading frame (ORF) of 1377 bp encoding a 458 amino acid polypeptide (GenBank accession no.

Self-catalyzed copper-silver complex inks for low-cost fabrication of highly oxidation-resistant and conductive copper-silver hybrid tracks at a low temperature below 100 °C.

Cu-Ag complex inks are developed for printing conductive tracks of low cost, high stability, and high conductivity on heat-sensitive substrates such as polyethylene terephthalate (PET) substrates. The inks show an obvious self-catalyzed characteristic due to the in situ formation of fresh metal nanoparticles which promote rapid decomposition and sintering of the inks at a low temperature below 100 °C. The temperature is 40-60 °C lower than those of general Cu complex inks and 100-120 °C lower than those of general Cu/Ag particle inks.

Bottom-Up Electrodeposition of Large-Scale Nanotwinned Copper within 3D Through Silicon Via.

This paper is the first to report a large-scale directcurrent electrodeposition of columnar nanotwinned copper within through silicon via (TSV) with a high aspect ratio (~4). With this newly developed technique, void-free nanotwinned copper array could be fabricated in low current density (30 mA/cm²) and convection conditions (300 rpm), which are the preconditions for copper deposition with a uniform deep-hole microstructure. The microstructure of a whole cross-section of deposited copper array was made up of (111) orientated columnar grains with parallel nanoscale twins that had thicknesses of about 22 nm.

TGMS in Rapeseed () Resulted in Aberrant Transcriptional Regulation, Asynchronous Microsporocyte Meiosis, Defective Tapetum, and Fused Sexine.

The thermo-sensitive genic male sterility (TGMS) line SP2S is a spontaneous rapeseed mutation with several traits that are favorable for the production of two-line hybrids. To uncover the key cellular events and genetic regulation associated with TGMS expression, a combined study using cytological observation, transcriptome profiling, and gene expression analysis was conducted for SP2S and its near-isogenic line SP2F grown under warm conditions. Asynchronous microsporocyte meiosis and abnormal tapetal plastids and elaioplasts were demonstrated in the anther of SP2S.

Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder.

With the purpose of improving the properties of the Sn-58Bi lead-free solder, micro-CuZnAl particles ranging from 0 to 0.4 wt % were added into the low temperature eutectic Sn-58Bi lead-free solder. After the experimental testing of micro-CuZnAl particles on the properties and microstructure of the Sn-58Bi solders, it was found that the wettability of the Sn-58Bi solders was obviously improved with addition of CuZnAl particles.

Cu₆Sn₅ Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer.

Cu₆Sn₅ whiskers precipitated in Sn3.0Ag0.5Cu/Cu interconnection in concentrator silicon solar cells solder layer were found and investigated after reflow soldering and during aging.