Interfacial Co-O-Cu bonds prompt electrochemical nitrate reduction to ammonia in neutral electrolyte.

In this work, the formed interfacial Co-O-Cu bonds in Co-doped Cu(OH) (Co-Cu(OH)) sufficiently expose active sites and improve the reaction kinetics. As a result, the optimal Co-Cu(OH) provides an amazing faradaic efficiency (91.6%), high selectivity (93.