Publications by authors named "Zhenbing Li"
Design of Power Amplifiers for BDS-3 Terminal Based on InGaP/GaAs HBT MMIC and LGA Technology.
Micromachines (Basel)
October 2023
Article Synopsis
- The paper discusses the design of a highly integrated RF power amplifier (PA) chip for the Beidou-3 satellite system, focusing on features like output power and efficiency.
- The PA uses advanced technologies like temperature-insensitive adaptive bias and harmonic suppression to achieve high performance, with testing showing notable gain and output power levels.
- This compact PA chip, measuring just 6 × 4 × 1 mm, demonstrates superior performance compared to similar designs, making it suitable for meeting the unique short message function of the BDS-3 terminal across various applications.
Hollow silica nanospheres with mesoporous shells were successfully fabricated with a new one-pot strategy by using a thermosensitive polymer, poly(N-isopropylacrylamide) (PNIPAm), as a reversible template without the need of further calcination or chemical etching. By simply regulating the solution temperature with respect to the lower critical solution temperature (LCST) of PNIPAm, PNIPAm chains can reversibly form aggregates or dissolve in aqueous solution. The thermosensitive character makes PNIPAm chains behave as soft templates for the formation of core-shell silica nanospheres at elevated temperature (>LCST), and they will then diffuse out of the cores at lower temperature (