The Stability and Electronic Structure of Cu(200)/AuCu(200) Interface: An Insight from First-Principle Calculation.

AuCu phase had a significant effect on the bonding strength of Au80Sn20 alloy and Cu substrate. The formation of the AuCu(200)/Cu(200) interface significantly improves the shear strength of solder joints. Therefore, it is particularly important to analyze the strengthening mechanism of the AuCu phase in the Cu matrix.

New Zr-25Ti-xMo alloys for dental implant application: Properties characterization and surface analysis.

A series of Zr-25Ti-xMo (x = 0, 2.5, 5, 7.5, 10 and 12.