Quantification of atomic force microscopy tip and sample thermal contact.

A thermal conduction measurement device was fabricated, consisting of a silicon dioxide membrane with integrated thermal sensors (Pt resistance heater/thermometer and Pt-Au thermocouples) using MEMS technology. Heat transfer between the heated device and a number of unused atomic force microscope and scanning thermal microscope probes was measured. Changes in thermal conduction related to changes in the tip shape resulting from initial contact were observed.