Effects of the chain length of nonaromatic epoxy resins on thermomechanical and optical properties: experiments, and and molecular dynamics simulations.

Epoxy resin has been extensively used in the field of advanced electronic materials as an adhesive and encapsulant owing to its excellent material properties. However, recently, there has been a demand for further improvement in heat resistance, high transparency, environmental resistance, and enhanced handling properties for high-brightness light-emitting diodes. Conventional aromatic epoxy resins lack light resistance; therefore, a colorless and transparent epoxy resin without aromatic rings is desirable.

Dissipative Particle Dynamics Simulation for Reaction-Induced Phase Separation of Thermoset/Thermoplastic Blends.

Reaction-induced phase separation occurs during the curing reaction when a thermoplastic resin is dissolved in a thermoset resin, which enables toughening of the thermoset resin. As resin properties vary significantly depending on the morphology of the phase-separated structure, controlling the morphology formation is of critical importance. Reaction-induced phase separation is a phenomenon that ranges from the chemical reaction scale to the mesoscale dynamics of polymer molecules.