Shape control of electrodeposited copper films and nanostructures through additive effects.

The use of electrolyte additives to affect nanocrystallite shape and film morphology in electrodeposited copper films is presented. Linear sweep and cyclic voltammetry, atomic force microscopy (AFM), scanning electron microscopy (SEM), and X-ray diffraction (XRD) methods are employed to investigate the effects of alcohol additives and the organic additive malachite green (MG), on copper electrodeposited onto polycrystalline gold electrodes. The use of additives affects the deposition process by increasing cathodic peak potentials and decreasing corresponding peak currents.