Study on Interfacial Bonding Properties of NiTi/CuSn10 Dissimilar Materials by Selective Laser Melting.

The dissimilar materials bonding of NiTi alloy with shape memory effect (SME) and CuSn10 alloy with good ductility, electrical conductivity, and thermal conductivity can be used in aerospace, circuits, etc. In order to integrate NiTi and CuSn10 with greatly different physical and chemical properties by selective laser melting (SLM), the effects of forming interlayers with different SLM process parameters were explored in this study. The defects, microstructure, and component diffusion at the interface were also analyzed.