Publications by authors named "Yu-Jyun Kao"
Article Synopsis
- The study investigates how varying concentrations of bis-(3-sulfopropyl) disulfide (SPS) in electroplated copper (Cu) foils impact their mechanical properties, particularly during tensile tests.
- It finds that the SPS concentration influences the grain size of the Cu foils, which is crucial for their reliability in electronic packaging applications.
- The research highlights a significant Hall-Petch effect, where changes in grain size due to SPS impurities lead to different fracture behaviors in the material.
