Improvement of Solder Joint Shear Strength under Formic Acid Atmosphere at A Low Temperature.

With the continuous reduction of chip size, fluxless soldering has brought attention to high-density, three-dimensional packaging. Although fluxless soldering technology with formic acid (FA) atmosphere has been presented, few studies have examined the effect of the Pt catalytic, preheating time, and soldering pad on FA soldering for the Sn-58Bi solder. The results have shown that the Pt catalytic can promote oxidation-reduction and the formation of a large pore in the Sn-58Bi/Cu solder joint, which causes a decrease in shear strength.

Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid-Liquid System under Formic Acid Atmosphere.

This study proposes a low-temperature transient liquid phase bonding (TLPB) method using Sn58Bi/porous Cu/Sn58Bi to enable efficient power-device packaging at high temperatures. The bonding mechanism is attributed to the rapid reaction between porous Cu and Sn58Bi solder, leading to the formation of intermetallic compounds with high melting point at low temperatures. The present paper investigates the effects of bonding atmosphere, bonding time, and external pressure on the shear strength of metal joints.

Significant Hall-Petch effect in micro-nanocrystalline electroplated copper controlled by SPS concentration.

Electroplated Cu has been extensively applied in advanced electronic packaging, and its mechanical properties are critical for reliability. In this study, Cu foils fabricated through electroplating with various bis-(3-sulfopropyl) disulfide (SPS) concentrations are examined using tensile tests. The SPS concentration affects the grain size of the electroplated Cu foils, resulting in different mechanical properties.

Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints.

Sn-rich solder joints in three-dimensional integrated circuits and their reliability issues, such as the electromigration (EM), thermomigration (TM), and thermomechanical fatigue (TMF), have drawn attention related to their use in electronic packaging. The Sn grain orientation is recognized as playing an important role in reliability issues due to its anisotropic diffusivity, mechanical properties, and coefficient of thermal expansion. This study reviews the effects of the Sn grain orientation on the EM, TM, and TMF in Sn-rich solder joints.

Nanotwin orientation on history-dependent stress decay in Cu nanopillar under constant strain.

Cu with nanotwin (NT) possesses great electrical, mechanical, and thermal properties and has potential for electronic applications. Various studies have reported the effect of NT orientation on Cu mechanical properties. However, its effect on Cu stress-relaxation behavior has not been clarified, particularly in nano-scale.

Observation of void formation patterns in SnAg films undergoing electromigration and simulation using random walk methods.

With the ever-reducing sizes of electronic devices, the problem of electromigration (EM) has become relevant and requires attention. However, only the EM behavior of Sn-Ag solders within the solder joint structure has been focused on thus far. Therefore, in this study, a thin metallic film composed of Sn-3.

Author Correction: Effect of FeCoNiCrCu High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder.

An amendment to this paper has been published and can be accessed via a link at the top of the paper.

Anisotropic Grain Growth in (111) Nanotwinned Cu Films by DC Electrodeposition.

We have reported a method of fabricating (111)-orientated nanotwinned copper (nt-Cu) by direct current electroplating. X-ray analysis was performed for the samples annealed at 200 to 350 °C for an hour. X-ray diffraction indicates that the (200) signal intensity increases while (111) decreases.

Suppressed Growth of (Fe, Cr Co Ni Cu)Sn Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu Substrate during Solid-state Aging.

High-entropy alloys (HEAs) are promising materials for next-generation applications because of their mechanical properties, excellent high-temperature stability, and resistance against oxidation and corrosion. Although many researchers have investigated high-temperature HEA applications, few have considered low-temperature applications. Here we demonstrate an unprecedented intermetallic compound of (Fe, Cr, Co, Ni, Cu)Sn at the interface between Sn-3.

Effect of FeCoNiCrCu High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder.

High-entropy alloys (HEAs) are well known for their excellent high-temperature stability, mechanical properties, and promising resistance against oxidation and corrosion. However, their low-temperature applications are rarely studied, particularly in electronic packaging. In this study, the interfacial reaction between a Sn-3.