Regulable crack patterns for the fabrication of high-performance transparent EMI shielding windows.

Crack pattern-based metal grid film is an ideal candidate material for transparent electromagnetic interference shielding optical windows. However, achieving crack patterns with narrow grid spacing, small wire width, and high connectivity remains challenging. Herein, an aqueous acrylic colloidal dispersion was developed as a crack precursor for preparing crack patterns.

Enhanced Adhesion of Copper Films on Fused Silica Glass Substrate by Plasma Pre-Treatment.

A non-thermal atmospheric jet plasma pre-treatment technique was introduced to help the growth of extremely sticky copper films on fused silica glass substrates. A tape test was utilized to assess the bonding quality between copper films and fused silica glass substrates. AFM was used to characterize the sample surface roughness and XPS for chemical bonding characterization.