Performance Improvement for the CuCrZr Alloy Produced by Laser Powder Bed Fusion Using the Remelting Process.

Owing to the high optical reflectivity of copper powder, the high-performance fabrication of copper alloys in the laser additive manufacturing (AM) field is problematic. To tackle this issue, this study employs the remelting process during laser powder bed fusion AM to fabricate defect-free and high-performance CuCrZr alloy. Compared to the non-remelting process, the remelting process yields finer grains, smaller precipitates, denser dislocations, and smaller dislocation cells.

Applications of multi-walled carbon nanotube in electronic packaging.

Thermal management of integrated circuit chip is an increasing important challenge faced today. Heat dissipation of the chip is generally achieved through the die attach material and solders. With the temperature gradients in these materials, high thermo-mechanical stress will be developed in them, and thus they must also be mechanically strong so as to provide a good mechanical support to the chip.