Publications by authors named "Yihua Deng"
Materials (Basel)
October 2024
Article Synopsis
- - This study assessed different curing methods (water, sealed, standard, and open air) for PCBAs over 28 days to determine their impact on the production of phosphogypsum-based cold-bonded aggregates.
- - Results showed that water curing rapidly increased aggregate strength to 5.26 MPa within 7 days, while standard curing yielded a 19.3% improvement in strength after 28 days by enhancing hydration products and optimizing pore structure.
- - The research also noted effective solidification of phosphorus impurities across all curing methods, providing valuable insights for optimizing PCBA curing in industrial settings.
