Publications by authors named "Xunda Liu"

The thermomechanical properties of materials within die-attach joints play an essential role in assessing the reliability of high-power modules. Ag-In transient liquid phase (TLP) bonding serves as an alternative method for die attachment. However, relevant material data for the ζ (AgIn) phase, one of the Ag-In intermetallic compound (IMC) products of TLP bonding, are limited.

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Background: In our search for new agrochemicals from endophytic fungi, the crude extract of the endophytic Hyalodendriella sp. Ponipodef12 associated with the hybrid 'Neva' of Populus deltoides Marsh × P. nigra L.

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