Assessment of the Risk of Crack Formation at a Hybrid Bonding Interface Using Numerical Analysis.

Hybrid bonding technology has recently emerged as a promising solution for advanced semiconductor packaging technologies. However, several reliability issues still pose challenges for commercialization. In this study, we investigated the possibility of crack formation caused by chemical mechanical polishing (CMP) defects and the misalignment of the hybrid bonding structure.

Mechanical Reliability Assessment of a Flexible Package Fabricated Using Laser-Assisted Bonding.

The aim of this study was to develop a flexible package technology using laser-assisted bonding (LAB) technology and an anisotropic solder paste (ASP) material ultimately to reduce the bonding temperature and enhance the flexibility and reliability of flexible devices. The heat transfer phenomena during the LAB process, mechanical deformation, and the flexibility of a flexible package were analyzed by experimental and numerical simulation methods. The flexible package was fabricated with a silicon chip and a polyimide (PI) substrate.