Wire Bow In Situ Measurement for Monitoring the Evolution of Sawing Capability of Diamond Wire Saw during Slicing Sapphire.

Electroplated diamond wire sawing is widely used as a processing method to cut hard and brittle difficult-to-machine materials. Currently, obtaining the sawing capability of diamond wire saw through the wire bow is still difficult. In this paper, a method for calculating the sawing capability of diamond wire saw in real-time based on the wire bow is proposed.

Investigation of the Anisotropy of 4H-SiC Materials in Nanoindentation and Scratch Experiments.

Silicon carbide is an ideal material for advanced electronics, military, and aerospace applications due to its superior physical and chemical properties. In order to understand the effect of crystal anisotropy of 4H-SiC on its processability, nanoindentation and nanoscratch tests on various crystallographic planes and orientations were performed and the results outlined in this paper. The results show that the C-plane of 4H-SiC is more rigid, while the Si-plane is more elastic and ductile.

Reactive Infiltration and Microstructural Characteristics of Sn-V Active Solder Alloys on Porous Graphite.

In this work, the reactive wetting and infiltration behaviors of a newly designed Sn-V binary alloy were comprehensively explored on porous graphite for the first time. It was discovered that 0.5 wt.

Molecular cloning, characterization, and immunolocalization of two lactate dehydrogenase homologous genes from Taenia solium.

Two novel genes encoding lactate dehydrogenase A (LDHA) and B (LDHB) homologues, respectively, were identified from the cDNA libraries of adult Taenia solium (T. solium). The two deduced amino acid sequences both show more than 50% identity to the homologues for Danio rerio, Xenopus laevis, Schistosoma japonicum, Sus scrofa, Homo sapiens, et al.