Publications by authors named "Xingfu Yu"

Article Synopsis
  • Microstamping significantly boosts the surface strength of alloy materials, specifically TiAl6V4, by increasing interatomic density and improving mechanical properties at the atomic level.
  • The research includes a detailed examination of how different overlap ratios during microstamping affect the damage mechanism, dislocation density, and overall material structure, revealing that dislocation density remains stable despite higher overlap.
  • Through simulations using ATOMSK and LAMMPS, the study proposes an optimal microstamping overlay ratio to enhance surface strength while minimizing processing time based on a thorough analysis of stress variations and microstructural changes.
View Article and Find Full Text PDF