Asperities play a central role in the mechanical and electrical properties of contacting surfaces. Changes in trends of uniaxial compression of an asperity tip in contact with a polycrystalline substrate as a function of substrate geometry, compressive stress and applied voltage are investigated here by implementation of a coupled continuum and atomistic approach. Surprisingly, an unmodified Au polycrystalline substrate is found to be softer than one containing a void for conditions of high stress and an applied voltage of 0.
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