Controlled Synthesis of Triangular Submicron-Sized CeO and Its Polishing Performance.

CeO is widely used in the field of chemical-mechanical polishing for integrated circuits. Morphology, particle size, crystallinity, and Ce concentration are crucial factors that affect polishing performance. In this study, we successfully synthesized two novel triangular CeO abrasives with similar particle sizes (600 nm) but different morphologies and Ce concentrations using a microwave-assisted hydrothermal method with high-concentration raw materials, and no surfactants or template agents were added.

The Effects of Precursors on the Morphology and Chemical Mechanical Polishing Performance of Ceria-Based Abrasives.

Ceria-based abrasives are widely used in precision chemical mechanical polishing (CMP) fields, such as thin film transistor liquid crystal display (TFT-LCD) glass substrates and integrated circuits, because of their excellent physicochemical properties. Rare earth carbonates, as precursors of ceria-based abrasives, directly affect the morphology of ceria-based abrasives, which, in turn, affects the material removal rate (MRR) and the surface roughness (R) after polishing. Herein, rare earth carbonates with different morphologies were obtained by adjusting reaction parameters during precipitation, including flake, spindle, and spheroid.