Microstructural Evolution in 2101 Lean Duplex Stainless Steel During Low- and Intermediate-Temperature Aging.

The microstructural evolution of a 2101 lean duplex stainless steel (DSS) during isothermal aging from room temperature to 470 °C was investigated using thermoelectric power (TEP) measurements to follow the kinetics, atom probe tomography, and transmission electron microscopy. Despite the low Ni, Cr, and Mo contents, the lean DSS was sensitive to α-α' phase separation and Ni-Mn-Si-Al-Cu clustering at intermediate temperatures. The time-temperature pairs characteristic of the early stages of ferrite decomposition were determined from the TEP kinetics.

M23C6 carbides and Cr2N nitrides in aged duplex stainless steel: A SEM, TEM and FIB tomography investigation.

The precipitation evolution during ageing of a 2101 lean duplex stainless steel was investigated, revealing that the precipitate type and morphology depends on the nature of the grain boundary. Triangular M23C6 carbides precipitate only at γ/δ interfaces and rod-like Cr2N nitrides precipitate at both γ/δ and δ/δ interfaces. After 15min of ageing, the M23C6 size no longer evolves, whereas that of the Cr2N continues to evolve.

Thermal conductivity and thermal boundary resistance of nanostructures.

: We present a fabrication process of low-cost superlattices and simulations related with the heat dissipation on them. The influence of the interfacial roughness on the thermal conductivity of semiconductor/semiconductor superlattices was studied by equilibrium and non-equilibrium molecular dynamics and on the Kapitza resistance of superlattice's interfaces by equilibrium molecular dynamics. The non-equilibrium method was the tool used for the prediction of the Kapitza resistance for a binary semiconductor/metal system.