Defect Localization and Nanofabrication for Conductive Structures with Voltage Contrast in Helium Ion Microscopy.

As the dimensions of feature sizes in electronic devices decrease to nanoscale, an easy method for failure analysis and evaluation of processing steps is required. Gallium-focused ion beam (Ga-FIB) or scanning electron microscope is an efficient approach to detect voltage contrast for addressing failure analysis in semiconductor devices and processing. However, Ga-FIB may cause damage or implantation to the surface of the analyzed area, and its resolution is low.