Publications by authors named "Wei-You Hsu"
Article Synopsis
- X-ray nanodiffraction was utilized to analyze thermal stress in 10 µm nanotwinned copper bumps within Cu/SiO hybrid structures across various temperatures from -55 °C to 200 °C.
- The study found that the Cu bumps experienced compressive thermal stress both before and after hybrid bonding, with an average stress value reaching -169.1 MPa at 200 °C.
- This research offers insights into the strain and stress behaviors of confined metal bumps and enhances understanding of hybrid bonding processes that do not require external compression.
In this study, thermal and argon (Ar) plasma/wetting treatments were combined to enhance the bonding strength of polyimide (PI) films. Attenuated total reflectance-Fourier transform infrared spectroscopy (ATR-FTIR) was used to analyze the changes in the PI imidization degrees. The contact angles of the PI films were also measured.
View Article and Find Full Text PDFThe electrochemical carbon dioxide reduction reaction (CORR) is a promising route to close the carbon cycle by reducing CO into valuable fuels and chemicals. Electrocatalysts with high selectivity toward a single product are economically desirable yet challenging to achieve. Herein, we demonstrated a highly (111)-oriented Cu foil electrocatalyst with dense twin boundaries (TB) (tw-Cu) that showed a high Faradaic efficiency of 86.
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