The impact of agricultural trade on green technological innovation in China's agricultural sector.

As environmental awareness grows, the agricultural sector must balance rising product demands with sustainable development. This study investigates the relationship between agricultural trade and green technological innovation, emphasizing how trade-induced efficiency improvements promote input-saving practices. Using panel data from 31 Chinese provinces between 2011 and 2021, our analysis reveals that agricultural trade significantly enhances resource use efficiency, particularly in rural areas where agriculture is concentrated.

Study on the existing forms and recovery efficiencies of phosphorus in biochar from excess sludge.

With the background of carbon neutrality, the resource and energy utilization of excess sludge (ES) have become the focus of future research. The pyrolysis of ES can produce biochar and enrich phosphorus (P). In this paper, the existing forms and recovery efficiencies of P in biochar from ES (BCES) were investigated.

Removal capacities and varying characteristics of substrates and microbial community structure in simultaneous sulfide and nitrate biological removal process'.

Under the background of carbon neutrality, resource and energy utilization technologies have become the focus of future research. The paper investigated the removal efficiencies and varying characteristics of substrates and microbial community structure in the simultaneous sulfide and nitrate biological removal (SSNBR) process. The results showed that the sulfide and nitrate removal loads reached 2.

Efficient and Controllable Preparation of Tridirectionally Anisotropic Sliding Surfaces Based on Spatial Light Modulator.

Realizing the efficient and controllable preparation of tridirectionally anisotropic sliding surfaces (TASSs) is extremely important. However, achieving efficient preparation of TASSs remains a great challenge. Using a spatial light modulator combined with an image feedback algorithm to adjust the femtosecond laser beam to multifocus array with a gradient intensity distribution is an efficient solution to achieve this target.

Optimization of Trepanning Patterns for Holes Ablated Using Nanosecond Pulse Laser in AlO Ceramics Substrate.

Trepanning pattern is an important factor in laser hole machining, affecting both the hole quality and process efficiency. The influence of laser trepanning patterns on the hole ablating using nanosecond pulse laser in AlO ceramics substrate was studied. Two laser trepanning patterns were evaluated, filled spiral trepanning and multiple rings trepanning, with the optimized laser machining parameters.

Percussion Drilling of Deep Holes Using Picosecond Ultrashort Pulse Laser in Ni-Based Superalloy Coated with Ceramic Thermal Barrier Coatings.

Ni-based superalloy with ceramic thermal barrier coatings (TBCs) is a composite material, which can be used in special environments with high temperature and high pressure such as aeroengine blade. In order to improve the cooling effect of the aeroengine, it is necessary to perform multi-size and large-area holes processing on the surface of blades. As a non-contact processing method with fast processing speed, good processing quality and almost no deformation, laser processing has been one of the important processing methods for film cooling hole processing of aeroengine blades.

Percussion Drilling Hole in Cu, Al, Ti, and Ni Alloys Using Ultra-Short Pulsed Laser Ablation.

Comparative study on micro-deep hole drilling by picosecond ultra-short pulse laser in four metals, including copper, aluminum alloy, titanium alloy, and nickel alloy, was presented. Destructive testing was performed to measure the depth, shape, and side-wall morphology of micro-deep holes in this study. Diameters and depths of micro-deep holes in four metals ablated using the same processing parameters were compared.

Microdrilling of Through-Holes in Flexible Printed Circuits Using Picosecond Ultrashort Pulse Laser.

High density and high quality interconnects are necessary for the preparation of miniaturized and lightweight electronic products. Therefore, small-diameter and high-density through-holes in FPCs (Flexible Printed Circuits) are required. However, the current processing methods cannot further decrease the diameters and improve the quality of through-holes.