Biomed Microdevices
December 2004
We have fabricated free-standing SiC nanoporous membranes in both p -type and n -type material. We showed that these membranes will permit the diffusion of proteins up to 29000 Daltons, while excluding larger proteins. By using radioactively labeled albumin, we also show that porous SiC has very low protein adsorption, comparable to the best commercially available polymer nanoporous membrane.
View Article and Find Full Text PDFWe report the observation of a paramagnetic interface defect in thermally oxidized porous n-type doped 4H-SiC/SiO(2). Based on its axial symmetry and resolved hyperfine interactions it is attributed to an sp(3) carbon dangling bond center situated at the SiC side of the interface. This center is electrically active and pins the Fermi level in the oxidized samples.
View Article and Find Full Text PDFEpitaxial silicon carbide is likely to contain hydrogen and vacancies ( V); therefore, V+nH complexes are likely to influence its electronic properties. Using ab initio calculations we show that neutral and positive H atoms are trapped by carbon vacancies ( V(C)) in three-center bonds with two Si neighbors. The double positive charge state of V(C)+H is not stable in equilibrium and in the triply positive state H binds only to one of the Si neighbors.
View Article and Find Full Text PDFWhen the GaAs substrate of a 5-microm Al(x)Ga(1-x) film is removed by chemical etching, oscillations in the film-layerformed Fabry-Perot cavity are observed in the low temperature photoluminescence spectrum.
View Article and Find Full Text PDFPulsed 100-nsec 10.6-microm laser damage characteristics of composite bare copper mirrors were determined. The mirrors were prepared by vapor deposition of a copper film on polished silicon carbide substrates formed by chemical vapor deposition, Comparisons are made with a bulk oxygen-free high-conductivity (OFHC) copper mirror prepared by precision diamond turning.
View Article and Find Full Text PDFThe change in absorptivity at 10.6 microm of copper samples, at various stages of polishing including ion polishing, is reported. The ion polishing apparatus is also described; it employs a low energy Xe ion beam incident at a glancing angle to maximize the removal rate while minimizing ion penetration and damage.
View Article and Find Full Text PDF