Design Guidelines for Thin Diaphragm-Based Microsystems through Comprehensive Numerical and Analytical Studies.

This paper presents comprehensive guidelines for the design and analysis of a thin diaphragm that is used in a variety of microsystems, including microphones and pressure sensors. It highlights the empirical relations that can be utilized for the design of thin diaphragm-based microsystems (TDMS). Design guidelines developed through a Finite Element Analysis (FEA) limit the iterative efforts to fabricate TDMS.

Investigation of temperature sensitivity of a MEMS gravimeter based on geometric anti-spring.

This paper describes a technique for temperature sensitivity or thermal sag measurements of a geometric anti-spring based microelectromechanical system (MEMS) gravimeter (Wee-g). The Wee-g MEMS gravimeter is currently fabricated on a (100) silicon wafer using standard micro-nano fabrication techniques. The thermal behavior of silicon indicates that the Young's modulus of silicon decreases with increase in temperature (∼64 ppm/K).