Publications by authors named "Van-Dung Mai"
Electronic packaging materials with high thermal conductivity and suitable viscosity are necessary in the manufacturing of highly integrated electronic devices for efficient heat dissipation during operation. This study looked at the effect of boron nitride (BN) platelets on the rheology and thermal conductivity of composites based on alumina (Al₂O₃) and epoxy resin (EP) for the potential application as electronic packaging. The viscosity and thermal conductivity of the composite were increased upon increasing filler content.
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- A bio-derived hardener, Van2HMDA, was created from vanillin and hexamethylene-1,6-diamine to cure epoxy resin, enhancing its properties.
- The resulting epoxy resin exhibits thermal-healing and reshaping capabilities due to the imine bonds in the hardener, with relaxation time properties showing a specific activation energy.
- While the resin is resistant to hydrolysis in water, it can be decomposed in acidic environments, allowing for eco-friendly recycling—but this process results in a lower quality material than the original.