Collaborative design of a care pathway for pharmacy-based PrEP delivery in Nigeria: insights from stakeholder consultation.

Background: HIV remains a significant public health problem, particularly in Africa, where two-thirds of global cases occur. Nigeria is among the three countries with the highest burden. Despite free access to pre- and post-exposure prophylaxis (PrEP and PEP) in Nigerian hospitals, stigma, distance, and restrictive clinic hours hinder uptake, especially among vulnerable populations.

Measurement of weld penetration depths in thin structures using transmission coefficients of laser-generated Lamb waves and neural network.

The Laser/EMAT ultrasonic (LEU) technique has shown the capability to measure weld penetration depths in thick structures based on ray-tracing of laser-generated bulk and surface waves. The ray-tracing method is not applicable to laser-generated Lamb waves when the LEU technique is used to measure weld penetration depths in thin structures. In this work, transmission coefficients of Lamb waves present in the LEU signals are investigated against varying weld penetration depths.

Inspection of notch depths in thin structures using transmission coefficients of laser-generated Lamb waves.

The non-contact feature of the Laser/EMAT ultrasonic (LEU) technique is attractive for its NDT applications. However, it is challenging to apply it in thin structures because of the difficulties in the signal interpretations. In this work, the LEU technique is used to inspect the notch depths in thin steel plates.

Laser ultrasonic technique for evaluating solder bump defects in flip chip packages using modal and signal analysis methods.

Current techniques for nondestructive quality evaluation of solder bumps in microelectronic packages have their own limitations and are unsuitable for in-line inspection because of high cost and low throughput. In order to meet requirements of quality inspection of electronic packages, a nondestructive and noncontact solder bump inspection system is being developed using laser ultrasound and interferometer techniques. This system uses a pulsed Nd:YAG laser to induce ultrasound in electronic packages in the thermoelastic regime; it then measures the transient out-of-plane displacement responses with an ultrasonic arrival on the surface of the packages using laser interferometer technique.