- The proliferation of electronic devices has increased their susceptibility to corrosion, especially in copper traces of printed circuit boards (PCBs), highlighting limitations in traditional protective methods like conformal coatings.
- This study explores using cold atmospheric plasma (CAP) to apply ultrathin silicon oxide (SiO) coatings onto copper surfaces, focusing on how scanning speed affects film quality and corrosion resistance.
- Results showed that a scanning speed of 45 mm/s yielded a 140 nm thick coating with 30-fold better corrosion resistance than uncoated copper, demonstrating the potential of CAP coatings over traditional methods in protecting electronic components like LEDs and PCBs used in agriculture.