Publications by authors named "Tongbo Wei"

Wide bandgap semiconductor AlGaN alloys have been identified as key materials to fabricate solar-blind ultraviolet photodetectors (SBUV PDs). Herein, a self-driven SBUV polarization-sensitive PD (PSPD) based on semipolar (112̅2)-oriented AlGaN films is reported. Using the flow-rate modulation epitaxy method, the full widths at half maximum (FWHMs) for the obtained (112̅2) AlGaN along [112̅3̅] and [11̅00] rocking curves are 0.

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The discrepancy in the photoresponse characteristics between photodetectors (PDs) and photosynapses is posing a challenge for integrating the two functions into a single device. In this work, a photodetector integrated with neuromorphic capabilities is demonstrated. Under the joint action of the photovoltaic effect and photoconductive effect, the proposed device can switch between the photodetector and photosynapse by simply altering the polarity of bias voltage.

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2D stacking presents a promising avenue for creating periodic superstructures that unveil novel physical phenomena. While extensive research has focused on lateral 2D material superstructures formed through composition modulation and twisted moiré structures, the exploration of vertical periodicity in 2D material superstructures remains limited. Although weak van der Waals interfaces enable layer-by-layer vertical stacking, traditional methods struggle to control in-plane crystal orientation over large areas, and the vertical dimension is constrained by unscalable, low-throughput processes, preventing the achievement of global order structures.

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Article Synopsis
  • The study explores hybrid selective laser melting (SLM) technology in conjunction with laser welding to create high-quality, complex metallic parts using materials like 304 stainless steel, Inconel 718, and Ti-6Al-4V alloy.
  • By comparing properties such as microstructure, microhardness, tensile strength, and corrosion resistance, researchers examined how SLM-induced anisotropy affects the performance of laser-welded joints.
  • Results indicated that while the microstructures were consistent, laser-welded joints generally exhibited different grain sizes and mechanical properties, suggesting that joining SLM parts via laser welding is feasible for producing large-scale components.
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The realization of high quality (0001) GaN on Si(100) is paramount importance for the monolithic integration of Si-based integrated circuits and GaN-enabled optoelectronic devices. Nevertheless, thorny issues including large thermal mismatch and distinct crystal symmetries typically bring about uncontrollable polycrystalline GaN formation with considerable surface roughness on standard Si(100). Here a breakthrough of high-quality single-crystalline GaN film on polycrystalline SiO/Si(100) is presented by quasi van der Waals epitaxy and fabricate the monolithically integrated photonic chips.

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In this work, selective laser melting (SLM) technology was applied to directly realize the synthesis of medium manganese Mn-Cu ( = 30-40 wt.%) alloys based on the blended elemental powders. The effects of heat treatment on the microstructural evolution and damping properties of the SLMed Mn-Cu alloys were investigated.

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We demonstrate the InGaN/GaN-based monolithic micro-pyramid white (MPW) vertical LED (VLED) grown on (-201)-oriented β-GaO substrate by selective area growth. The transmission electron microscopy (TEM) reveals an almost defect-free GaN pyramid structure on (10-11) sidewalls, including stacked dual-wavelength multi-quantum wells (MQWs). From the electroluminescence (EL) spectra of the fabricated MPW VLED, a white light emission with a high color rendering index (CRI) of 97.

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Epitaxy growth and mechanical transfer of high-quality III-nitrides using 2D materials, weakly bonded by van der Waals force, becomes an important technology for semiconductor industry. In this work, wafer-scale transferrable GaN epilayer with low dislocation density is successfully achieved through AlN/h-BN composite buffer layer and its application in flexible InGaN-based light-emitting diodes (LEDs) is demonstrated. Guided by first-principles calculations, the nucleation and bonding mechanism of GaN and AlN on h-BN is presented, and it is confirmed that the adsorption energy of Al atoms on O -plasma-treated h-BN is over 1 eV larger than that of Ga atoms.

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Localized surface plasmon resonance (LSPR)-enhanced deep ultraviolet (DUV) Micro-light emitting diodes (Micro-LEDs) using Al nanotriangle arrays (NTAs) are reported for improving the -3 dB modulation bandwidth. Through self-assembled nanospheres, the high-density Al NTAs arrays are transferred into the designated p-AlGaN region of the Micro-LEDs, realizing the effect of LSPR coupling. A 2.

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This paper presents a new metal-contact RF MEMS switch based on an Al-Sc alloy. The use of an Al-Sc alloy is intended to replace the traditional Au-Au contact, which can greatly improve the hardness of the contact, and thus improve the reliability of the switch. The multi-layer stack structure is adopted to achieve the low switch line resistance and hard contact surface.

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We have demonstrated piezo-phototronic enhanced modulation in green InGaN/GaN multiple quantum well (MQW) light-emitting diodes (LEDs) with a microwire array (MWA) structure. It is found that an a-axis oriented MWA structure induces more c-axis compressive strain than a flat structure when a convex bending strain is applied. Moreover, the photoluminescence (PL) intensity exhibits a tendency to increase first and then decrease under the enhanced compressive strain.

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The heteroepitaxy of high-quality aluminum nitride (AlN) with low stress is essential for the development of energy-efficient deep ultraviolet light-emitting diodes (DUV-LEDs). In this work, we realize that quasi-van der Waals epitaxy growth of a stress-released AlN film with low dislocation density on hexagonal boron nitride (h-BN)/sapphire suffered from high-temperature annealing (HTA) treatment and demonstrate its application in a DUV-LED. It is revealed that HTA effectively improves the crystalline quality and surface morphology of monolayer h-BN.

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The dual-wavelength InGaN/GaN micro light emitting diode (Micro-LED) arrays are fabricated by flip-chip parallel connection. It is noted that the Micro-LED arrays with smaller diameter present considerably bigger light output power density (LOPD). For all Micro-LEDs, the LOPD increases continuously with increasing injection current density until it "turns over".

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Use of 2D materials as buffer layers has prospects in nitride epitaxy on symmetry mismatched substrates. However, the control of lattice arrangement via 2D materials at the heterointerface presents certain challenges. In this study, the epitaxy of single-crystalline GaN film on WS -glass wafer is successfully performed by using the strong polarity of WS buffer layer and its perfectly matching lattice geometry with GaN.

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In this Letter, we describe the fabrication of three dimensional (3D) truncated-hexagonal-pyramid (THP) vertical light emitting diodes (VLEDs) with white emission grown on β-GaO substrate. In the 3D n-GaN layer, it is noted that the longitudinal growth rate of the 3D n-GaN layer increases as the flow rate of N decreases and H increases. Moreover, the 3D THP VLED can effectively suppress the quantum-confined Stark effect (QCSE) compared with planar VLEDs due to the semipolar facets and strain relaxation.

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The high-quality semipolar (112̅2) AlGaN epitaxial films have been obtained on m-plane sapphire by metal-organic chemical vapor deposition. X-ray rocking curve measurements show the full-width at half-maximums of semipolar (112̅2)-oriented AlGaN films are 0.357° and 0.

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Remote heteroepitaxy is known to yield semiconductor films with better quality. However, the atomic mechanisms in systems with large mismatches are still unclear. Herein, low-strain single-crystalline nitride films are achieved on highly mismatched (∼16.

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The energy-efficient deep ultraviolet (DUV) optoelectronic devices suffer from critical issues associated with the poor quality and large strain of nitride material system caused by the inherent mismatch of heteroepitaxy. In this work, we have prepared the strain-free AlN film with low dislocation density (DD) by graphene (Gr)-driving strain-pre-store engineering and a unique mechanism of strain-relaxation in quasi-van der Waals (QvdW) epitaxy is presented. The DD in AlN epilayer with Gr exhibits an anomalous sawtooth-like evolution during the whole epitaxy process.

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The performance of nitride devices is strongly affected by their polarity. Understanding the polarity determination and evolution mechanism of polar wurtzite nitrides on nonpolar substrates is therefore critically important. This work confirms that the polarity of AlN on sapphire prepared by metal-organic chemical vapor deposition is not inherited from the nitrides/sapphire interface as widely accepted, instead, experiences a spontaneous polarity inversion during the growth.

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Formation of graphene wrinkle arrays can periodically alter the electrical properties and chemical reactivity of graphene, which is promising for numerous applications. However, large-area fabrication of graphene wrinkle arrays remains unachievable with a high density and defined orientations, especially on rigid substrates. Herein, relying on the understanding of the formation mechanism of transfer-related graphene wrinkles, the graphene wrinkle arrays are fabricated without altering the crystalline orientation of entire graphene films.

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Van der Waals epitaxy provides a fertile playground for the monolithic integration of various materials for advanced electronics and optoelectronics. Here, a previously unidentified nanorod-assisted van der Waals epitaxy is developed and nearly single-crystalline GaN films are first grown on amorphous silica glass substrates using a graphene interfacial layer. The epitaxial GaN-based light-emitting diode structures, with a record internal quantum efficiency, can be readily lifted off, becoming large-size flexible devices.

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The nitride films with high indium (In) composition play a crucial role in the fabrication of In-rich InGaN-based optoelectronic devices. However, a major limitation is In incorporation requiring a low temperature during growth at the expense of nitride dissociation. Here, to overcome this limitation, a strain-modulated growth method, namely the graphene (Gr)-nanorod (NR) enhanced quasi-van der Waals epitaxy, is proposed to increase the In composition in InGaN alloy.

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Efficient and low-cost production of high-quality aluminum nitride (AlN) films during heteroepitaxy is the key for the development of deep ultraviolet light-emitting diodes (DUV-LEDs). Here, the quasi-2D growth of high-quality AlN film with low strain and low dislocation density on graphene (Gr) is presented and a high-performance 272 nm DUV-LED is demonstrated. Guided by first-principles calculations, it is found that AlN grown on Gr prefers lateral growth both energetically and kinetically, thereby resulting in a Gr-driven quasi-2D growth mode.

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Synopsis of recent research by authors named "Tongbo Wei"

  • - Tongbo Wei's research primarily focuses on advancements in materials science and semiconductor technology, specifically exploring the application of selective laser melting (SLM) for various alloys and investigating novel epitaxial growth techniques for GaN-based devices.
  • - Recent studies highlight the comparative analysis of laser welding behaviors in different alloys, the development of high-quality single-crystalline GaN films, and novel structures for efficient light-emitting diodes, emphasizing the implications for optoelectronic integration and flexible electronics.
  • - Findings from Tongbo Wei's work contribute to enhancing the performance and reliability of electronic components, such as RF MEMS switches and Micro-LEDs, through innovative methods like quasi van der Waals epitaxy and the incorporation of advanced materials.

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