Sustainable value added material use of occurring by-products from sugar and rice production in Vietnam.

Due to the worldwide growing population, the demand on food increases, which results in the need for a higher productivity in agriculture. Generally, this leads to larger amounts of agricultural residues and by-products, which may cause severe environmental risks due to emissions from simple burning or storing, especially in emerging and developing countries. In Vietnam agricultural by-products arise in total of 118 Mt per year, whereas 80% are coming from rice and sugar cane processing.

Risk factors associated with acute hepatopancreatic necrosis disease at shrimp farm level in Bac Lieu Province, Vietnam.

Background And Aim: Acute hepatopancreatic necrosis disease (AHPND) is a severe disease in shrimp farms and adversely affected the shrimp industry of Vietnam. So far, the study on risk factors associated with AHPND outbreaks is limited. The objective of this study was to determine the potential risk factors of AHPND at the shrimp farm level in Bac Lieu Province, Vietnam.

Magnetostrictive Performance of Electrodeposited TbDyFe Thin Film with Microcantilever Structures.

The microfabrication with a magnetostrictive TbDyFe thin film for magnetic microactuators is developed, and the magnetic and magnetostrictive actuation performances of the deposited thin film are evaluated. The magnetostrictive thin film of TbDyFe is deposited on a metal seed layer by electrodeposition using a potentiostat in an aqueous solution. Bi-material cantilever structures with the TbDyFe thin-film are fabricated using microfabrication, and the magnetic actuation performances are evaluated under the application of a magnetic field.

Thermoelectrical properties of silicon substrates with nanopores synthesized by metal-assisted chemical etching.

A silicon substrate consisting of nanoporous silicon film could enhance the thermoelectric performance of bulk silicon due to its low thermal conductivity. Metal-assisted chemical etching (MACE) is a wet method for fabricating diverse nano/micro structures, which uses a noble metal as the catalyst for etching of semiconductor materials. In this study, we report the thermoelectrical properties of silicon substrates with nanopores in different porosities fabricated by MACE employing Ag nanoparticle as a metal catalyst.

Design and Fabrication of Capacitive Silicon Nanomechanical Resonators with Selective Vibration of a High-Order Mode.

This paper reports the design and fabrication of capacitive silicon nanomechanical resonators with the selective vibration of a high-order mode. Fixed-fixed beam capacitive silicon resonators have been successfully produced by the use of electron beam lithography, photolithography, deep reactive ion etching, and anodic bonding methods. All resonators with different vibration modes are designed to have the same resonant frequency for performance comparison.

Synthesis and Evaluation of Thick Films of Electrochemically Deposited Bi₂Te₃ and Sb₂Te₃ Thermoelectric Materials.

This paper presents the results of the synthesis and evaluation of thick thermoelectric films that may be used for such applications as thermoelectric power generators. Two types of electrochemical deposition methods, constant and pulsed deposition with improved techniques for both N-type bismuth telluride (Bi₂Te₃) and P-type antimony telluride (Sb₂Te₃), are performed and compared. As a result, highly oriented Bi₂Te₃ and Sb₂Te₃ thick films with a bulk-like structure are successfully synthesized with high Seebeck coefficients and low electrical resistivities.

Fabrication of Vacuum-Sealed Capacitive Micromachined Ultrasonic Transducer Arrays Using Glass Reflow Process.

This paper presents a process for the fabrication of vacuum-sealed capacitive micromachined ultrasonic transducer (CMUT) arrays using glass reflow and anodic bonding techniques. Silicon through-wafer interconnects have been investigated by the glass reflow process. Then, the patterned silicon-glass reflow wafer is anodically bonded to an SOI (silicon-on-insulator) wafer for the fabrication of CMUT devices.