Nanomaterials (Basel)
November 2022
Cu-Ag composite pastes consisting of carboxylate-capped Ag nanoparticles, spray-pyrolyzed Ag submicron particles, and copper formate were developed in this study for low-temperature low-pressure bonding. The joints between the Cu, Ni/Au, and Ag finished substrates can be well formed at temperatures as low as 160 °C under a load pressure of 1.6 MPa.
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