Publications by authors named "Tien-Lin Lu"
Anisotropic Grain Growth in (111) Nanotwinned Cu Films by DC Electrodeposition.
Materials (Basel)
December 2019
Article Synopsis
- A method for creating (111)-oriented nanotwinned copper (nt-Cu) via direct current electroplating has been developed and analyzed.
- X-ray diffraction results indicate that, as the temperature increases during annealing, the (200) signal's intensity rises while the (111) signal's intensity decreases, suggesting changes in grain structure.
- The average grain size of the nt-Cu increased significantly after annealing, making it a promising material for use in electrical applications like interconnects and 3D integrated circuit packaging.