Publications by authors named "Tien Hsi Lee"

In this study, the fabrication of microfluidic chips through the bonding of poly (methyl methacrylate) (PMMA) boards featuring designed patterns to create a three-dimensional sandwich structure with embedded microchannels was explored. A key focus was optimization of the interface quality of bonded PMMA pairs by adjusting the solvent, such as such as acetone, alcohol, and their mixture. Annealing was conducted below 50 °C to leverage the advantages of low-temperature bonding.

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A novel integration of three-dimensional (3D) architectures of near-field electrospun polyvinylidene fluoride (PVDF) nano-micro fibers (NMFs) is applied to an intelligent self-powered sound-sensing element (ISSE). Using 3D architecture with greatly enhanced piezoelectric output, the sound wave energy can be harvested under a sound pressure of 120+ dB SPL of electrical signal about 0.25 V.

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