Shock-induced breaking of the nanowire with the dependence of crystallographic orientation and strain rate.

The failure of the metallic nanowire has raised concerns due to its applied reliability in nanoelectromechanical system. In this article, the breaking failure is studied for the [100], [110], and [111] single-crystal copper nanowires at different strain rates. The statistical breaking position distributions of the nanowires have been investigated to give the effects of strain rate and crystallographic orientation on micro-atomic fluctuation in the symmetric stretching of the nanowires.

Shock-induced breaking in the gold nanowire with the influence of defects and strain rates.

Defects in metallic nanowires have raised concerns about the applied reliability of the nanowires in nanoelectromechanical systems. In this paper, molecular dynamics simulations are used to study the deformation and breaking failure of the [100] single-crystal gold nanowires containing defects at different strain rates. The statistical breaking position distributions of the nanowires show mechanical shocks play a critical role in the deformation of nanowires at different strain rates, and deformation mechanism of the nanowire containing defects is based on a competition between shocks and defects in the deformation process of the nanowire.

Nanoscale interface of metals for withstanding momentary shocks of compression.

The failure of the nanoscale metallic interface has raised concerns owing to the effect interfacial amalgamation has on its application in nanoelectronic devices. Single crystal copper [110] and [100], which are set as two components of [110]‖[100] nanocrystalline copper, are used to simulate the interfacial properties using molecular dynamics simulations. Repeated tension and compression cycles show that the two components of the interface can come into contact and separate without interfacial amalgamation.