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Publications by authors named "Tianyue Bai"

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Long-Term Dynamic Stability of the Interfacial CuSn Texture in SAC305/Cu Joints by Laser Jet Solder Ball Bonding for Advanced Packaging.
Di Liu Tianyue Bai Yuanyuan Qiao Wei Dong Ning Zhao

ACS Appl Mater Interfaces

March 2025

Green and energy-efficient laser soldering technology has been recently developed in electronic packaging to overcome the limitations of conventional soldering. In this study, different sized Sn-3.0Ag-0.

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