This paper proposes a novel System-in-Package (SiP) integrated architecture that incorporates Silicon-On-Insulator (SOI) switches and Surface Acoustic Wave (SAW) filters within the chip, aiming to fulfill the demands for miniaturization and multi-functionality for application in emerging wireless technologies. The proposed architecture not only reduces the integration complexity but also considers the architectural design of the integrated module, impedance matching techniques, and signal integrity for carrier aggregation (CA) technology realization. The feasibility of employing SOI switches and SAW filters based on SiP design has been validated through the trial production of a Sub-3GHz radio frequency (RF) front-end diversity receiver module.
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January 2022
A multiple-input-multiple-output (MIMO) antenna array for triple-band 5G metal-frame smartphone applications is proposed in this paper. Each single antenna element consists of an S-shaped feeding strip and an L-shaped radiation strip on the metal frame. The dimension of the antenna element is only 6.
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