Localized and Programmable Chemical Vapor Deposition Using an Electrically Charged and Guided Molecular Flux.

Chemical vapor deposition is a widely used material deposition technique. It commonly provides a uniform material flux to the substrate to cause uniform thin film growth. However, the ability to precisely adjust the local deposition rate would be highly preferable.

Integrated multilayer stretchable printed circuit boards paving the way for deformable active matrix.

Conventional rigid electronic systems use a number of metallization layers to route all necessary connections to and from isolated surface mount devices using well-established printed circuit board technology. In contrast, present solutions to prepare stretchable electronic systems are typically confined to a single stretchable metallization layer. Crossovers and vertical interconnect accesses remain challenging; consequently, no reliable stretchable printed circuit board (SPCB) method has established.

Gas Phase Electrodeposition Enabling the Programmable Three-Dimensional Growth of a Multimodal Room Temperature Nanobridge Gas Sensor Array.

Parallel three-dimensional (3D) growth of different nanomaterials with submicrometer resolution is a promising approach to overcome some technological and economic limits encountered in planar integrated homogeneous films. The programmable multimaterial gas phase nanoparticle electrodeposition concept enables the fabrication of a 3D multimodal conductometric gas sensor array. The approach requires the deposition of more than one nanomaterial to achieve orthogonal sensing capabilities and multigas sensitivity and selectivity.

Fluidic Self-Assembly on Electroplated Multilayer Solder Bumps with Tailored Transformation Imprinted Melting Points.

This communication presents fluidic self-assembly of Si-chip on a sequentially electroplated multilayer solder bump with tailored transformation imprinted melting points. The multilayer solder bump is a lead free ternary solder system, which provides a route to transform the melting point of interconnects for applications in solder directed fluidic self-assembly. The outermost metal layers form a low melting point BiIn solder shell (72 °C).

Surface Tension Directed Fluidic Self-Assembly of Semiconductor Chips across Length Scales and Material Boundaries.

This publication provides an overview and discusses some challenges of surface tension directed fluidic self-assembly of semiconductor chips which are transported in a liquid medium. The discussion is limited to surface tension directed self-assembly where the capture, alignment, and electrical connection process is driven by the surface free energy of molten solder bumps where the authors have made a contribution. The general context is to develop a massively parallel and scalable assembly process to overcome some of the limitations of current robotic pick and place and serial wire bonding concepts.

Approaching Gas Phase Electrodeposition: Process and Optimization to Enable the Self-Aligned Growth of 3D Nanobridge-Based Interconnects.

A nanowire bonding process referred to as gas-phase electrodeposition is reported to form nanobridge-based interconnects. The process is able to grow free-standing point-to-point electrical connections using metallic wires. As a demonstration, programmable interconnects and an interdigitated electrode array are shown.

Millimeter Thin and Rubber-Like Solid-State Lighting Modules Fabricated Using Roll-to-Roll Fluidic Self-Assembly and Lamination.

A millimeter thin rubber-like solid-state lighting module is reported. The fabrication of the lighting module incorporates assembly and electrical connection of light-emitting diodes (LEDs). The assembly is achieved using a roll-to-roll fluidic self-assembly.

Active matrix-based collection of airborne analytes: an analyte recording chip providing exposure history and finger print.

In the field of sensors that target the detection of airborne analytes, Corona/lens-based-collection provides a new path to achieve a high sensitivity. An active-matrix-based analyte collection approach referred to as "airborne analyte memory chip/recorder" is demonstrated, which takes and stores airborne analytes in a matrix to provide an exposure history for off-site analysis.

A first implementation of an automated reel-to-reel fluidic self-assembly machine.

A first automated reel-to-reel fluidic selfassembly process for macroelectronic applications is reported. This system enables high-speed assembly of semiconductor dies (15 000 chips per hour using a 2.5 cm-wide web) over large-area substrates.

Effective collection and detection of airborne species using SERS-based detection and localized electrodynamic precipitation.

Three different delivery concepts (standard diffusion, global electrodynamic precipitation, and localized nanolens-based precipitation) and three different SERS enhancement layers (a silver film, a nanolens-based localized silver nanoparticle film, and the standard AgFON) are compared. The nanolens concept is applied to increase the SERS signal: a factor of 633, when compared to a standard mechanism of diffusion, is observed.

Integrated optofluidic system for monitoring particle mass concentrations based on planar emitter-receiver units.

We demonstrate an integrated optofluidic system for monitoring the particle mass concentration and the Sauter mean diameter of polydisperse flowing suspensions of water and standardized test dust. For optimum integration, a planar emitter-receiver unit is developed and fabricated on Si technology. A vertical cavity surface emitting laser at 850 nm serves as light source, and monolithically integrated segmented photodiodes detect both the attenuation of the primary light beam and the scattered light.