The dual sintering of copper (Cu) nanoparticles (NPs) was introduced to produce conductive patterns suitable for flexible electronics applications. In this method, laser irradiation using a Nd:YAG laser with a wavelength of 1064 nm was performed at laser powers of 400, 600 and 800 mJ. The laser irradiation time was 15 and 30 s for each laser power.
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