Purpose: To evaluate the effects of the temperature of air used for solvent evaporation on water sorption, solubility, and ultimate tensile strength (UTS) of simplified etch-and-rinse adhesives.
Materials And Methods: Four commercial simplified etch-and-rinse adhesives (Adper Single Bond 2 [SB]; Te Econom [TE]; XP Bond [XP] and Ambar [AM]) were selected. Disk-shaped specimens were prepared by dispensing the uncured resin into a mold (5.