Publications by authors named "Tamas Hurtony"
This study investigates the mechanism and effects of incorporating different ZrO nano-particles into SAC0307 solder alloys. ZrO nano-powder and nano-fibers in 0.25-0.
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- Researchers studied a solder alloy (Sn99Ag0.3Cu0.7) reinforced with different sizes of ZnO nanoparticles to understand how they affect the alloy's properties.
- They found that adding ZnO reduced the wettability, which led to more voids in the solder, but the mechanical strength and thermoelectric performance remained similar to the standard alloy.
- Improved wettability could be achieved with more active fluxes, suggesting that these ZnO composite solders might be beneficial for high-power applications.
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- Manganese is a cost-effective and safe addition to lead-free SAC solder alloys, enhancing their properties.
- This study compared the mechanical properties of a new Mn-alloyed solder (SAC0307-Mn07) with a traditional alloy (SAC305), focusing on shear force and Vickers hardness.
- Results showed that SAC0307-Mn07 had lower shear strength and hardness but featured rougher intermetallic layers, potentially improving the durability of solder joints in electronics.
The effect of the microstructure of solder joints on the thermal properties of power LEDs is investigated. Solder joints were prepared with different solder pastes, namely 99Sn0.3Ag0.
View Article and Find Full Text PDFThe effect of copper substrate roughness and tin layer thickness were investigated on whisker development in the case of Sn thin-films. Sn was vacuum-evaporated onto both unpolished and mechanically polished Cu substrates with 1 µm and 2 μm average layer thicknesses. The samples were stored in room conditions for 60 days.
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