Investigation and direct observation of sidewall leakage current of InGaN-Based green micro-light-emitting diodes.

Electrical and optical characteristics of InGaN-based green micro-light-emitting diodes (µLEDs) with different active areas are investigated; results are as follows. Reverse and forward leakage currents of µLED increase as emission area is reduced owing to the non-radiative recombination process at the sidewall defects; this is more prominent in smaller µLED because of larger surface-to-volume ratio. Leakage currents of µLEDs deteriorate the carrier injection to light-emitting quantum wells, thereby degrading their external quantum efficiency.

Realization of Broad-Spectrum Using Chirped Multi-Quantum Well Structures in AlGaInP-Based Light-Emitting Diodes.

We studied broad-spectrum light emitting diodes appropriate for special lighting applications in terms of their optical behaviors and device performances according to the chirped multi-quantum well structures. As the well thickness from 1 st to 3rd well was changed from 6 nm to 15 nm and repeated three times, the electroluminescent spectrum was broadened by 65% and the light output power was increased by 8% in comparison to light emitting diodes having conventional multi-quantum well structures. In the case of the chirped multi-quantum well structures having sequentially decreasing the well thickness from 15 nm to 6 nm and repeating three times, the optical output power was decreased by 5% due to the carrier leakage out of the active region.

A discrete core-shell-like micro-light-emitting diode array grown on sapphire nano-membranes.

A discrete core-shell-like micro-light-emitting diode (micro-LED) array was grown on a 100 nm-thick sapphire nano-membrane array without harmful plasma etching for chip singulation. Due to proper design for the sapphire nano-membrane array, an array of multi-faceted micro-LEDs with size of 4 μm × 16 μm was grown. Threading dislocation density in the micro-LED formed on sapphire nano-membrane was reduced by 59.

Stable and efficient transfer-printing including repair using a GaN-based microscale light-emitting diode array for deformable displays.

GaN-based microscale light-emitting diodes (μLEDs) are reported for assembly into deformable displays and repair systems. A stamp-imprinting method that enables large area assembly without spatial limitation is involved in the system, and a selective pick-up method is presented that includes a method for removing detected defective chips through micro-pulsed laser scanning. The photosensitive functional material, which is an accepted layer for the stable imprinting of chips, is determined by controlling the adhesion.

Air-Hybrid Distributed Bragg Reflector Structure for Improving the Light Output Power in AlGalnP-Based LEDs.

We investigated air gap-induced hybrid distributed Bragg reflectors (AH-DBRs) for use in high brightness and reliable AlGalnP-based light emitting diodes (LEDs). An air gap was inserted into the side of DBRs by selectively etching the Al(x),Ga1-xAs DBR structures. With the AH-DBR structures, the optical output power of LEDs was enhanced by 15% compared to LEDs having conventional DBRs, due to the effective reflection of obliquely incident light by the air gap structures.

Three-Dimensional Porous Copper-Graphene Heterostructures with Durability and High Heat Dissipation Performance.

Porous materials have historically been of interest for a wide range of applications in thermal management, for example, in heat exchangers and thermal barriers. Rapid progress in electronic and optoelectronic technology necessitates more efficient spreading and dissipation of the heat generated in these devices, calling for the development of new thermal management materials. Here, we report an effective technique for the synthesis of porous Cu-graphene heterostructures with pores of about 30 μm and a porosity of 35%.

Vertically stacked color tunable light-emitting diodes fabricated using wafer bonding and transfer printing.

We report on the vertically stacked color tunable light-emitting diodes (LEDs) fabricated using wafer bonding with an indium tin oxide (ITO) layer and transfer printing by the laser lift-off process. Employing optically transparent and electrically conductive ITO as an adhesion layer enables to bond the GaN-based blue and AlGaInP-based yellow LEDs. We find out that the interdiffusion of In, O, and Ga at the interface between ITO and GaP allows the strong bonding of the heterogeneous optoelectronic materials and the integration of two different color LEDs on a single substrate.

Enhanced current transport and injection in thin-film gallium-nitride light-emitting diodes by laser-based doping.

This paper reports improvements in the electrical and optical properties of blue-emission gallium nitride (GaN)-based thin-film light-emitting diodes (TFLEDs) after laser-based Si doping (LBSD) of a nitrogen-face n-GaN (denoted as hereafter n-GaN) layer. Experimental results show that the light-output powers of the flat- and rough-surface TFLEDs after LBSD are 52.1 and 11.

Light-output enhancement of GaN-based vertical light-emitting diodes using periodic and conical nanopillar structures.

We investigated GaN-based vertical light-emitting diodes (VLEDs) with periodic and conical nanopillar arrays (CNAs) to improve the light-output efficiency. We found that a 470 nm diameter and 0.8-0.

Fabrication of vertical light emitting diode based on thermal deformation of nanoporous GaN and removable mechanical supporter.

A GaN vertical light emitting diode (LED) based on the novel lift-off method was demonstrated by high temperature regrowth over nanoporous (NP) GaN template formed by electrochemical (EC) etching. A two-step EC etching process was employed on a SiO2 patterned GaN surface to fabricate a nanoporous template with a controlled porosity profile, which enabled better structural stability than a single NP GaN. During the regrowth of LED structures, the high porosity GaN layer produced large coalesced voids due to the thermal deformation of nanopores.

Enhanced luminous efficacy in phosphor-converted white vertical light-emitting diodes using low index layer.

We demonstrated improved luminous efficacy for GaN-based vertical light emitting diodes (VLEDs) employing a low index layer composed of silicon dioxide (SiO(2)) on the top surface. Three-dimensional ðnite-difference time-domain simulations for the fabricated VLED chip show that the penetration ratio of the emitted/reflected light into the VLED chip decreased by approximately 20% compared to a normal VLED chip. This result is in good agreement with an empirical study stating that white VLEDs having a SiO(2) layer exhibit an 8.

Fabrication of 380 nm ultra violet light emitting diodes on nano-patterned n-type GaN substrate.

380 nm ultraviolet (UV) light emitting diodes (LEDs) were grown on patterned n-type GaN substrate (PNS) with silicon dioxide (SiO2) nano pattern to improve the light output efficiency. Wet etched self assembled indium tin oxide (ITO) nano clusters serves as dry etching mask for converting the SiO2 layer grown on n-GaN template into SiO2 nano patterns by inductively coupled plasma etching. Three different diameter of ITO such as 200, 250 and 300 nm were used for SiO2 nano pattern fabrication.