Publications by authors named "Tae Yeong Hong"
Micromachines (Basel)
September 2024
Article Synopsis
- The increasing demand for high-density semiconductor systems leads to challenges with high current density and heat generation in interconnects, which are crucial for current signal transmission.
- Despite their significance, interconnects have received less research attention compared to individual devices, and increased integration density results in higher losses in these pathways.
- This study proposes a method to analyze power efficiency by comparing simulation and measurement outcomes, focusing on the impact of contact area ratios, and suggests structural improvements to enhance power efficiency and reliability in semiconductor systems.
