Temperature and wavelength drift tolerant WDM transmission and routing in on-chip silicon photonic interconnects.

We demonstrate a temperature and wavelength shift resilient silicon transmission and routing interconnect system suitable for multi-socket interconnects, utilizing a dual-strategy CLIPP feedback circuitry that safeguards the operating point of the constituent photonic building blocks along the entire on-chip transmission-multiplexing-routing chain. The control circuit leverages a novel control power-independent and calibration-free locking strategy that exploits the 2 derivative of ring resonator modulators (RMs) transfer function to lock them close to the point of minimum transmission penalty. The system performance was evaluated on an integrated Silicon Photonics 2-socket demonstrator, enforcing control over a chain of RM-MUX-AWGR resonant structures and stressed against thermal and wavelength shift perturbations.

Photonic (computational) memories: tunable nanophotonics for data storage and computing.

The exponential growth of information stored in data centers and computational power required for various data-intensive applications, such as deep learning and AI, call for new strategies to improve or move beyond the traditional von Neumann architecture. Recent achievements in information storage and computation in the optical domain, enabling energy-efficient, fast, and high-bandwidth data processing, show great potential for photonics to overcome the von Neumann bottleneck and reduce the energy wasted to Joule heating. Optically readable memories are fundamental in this process, and while light-based storage has traditionally (and commercially) employed free-space optics, recent developments in photonic integrated circuits (PICs) and optical nano-materials have opened the doors to new opportunities on-chip.

4-channel 200 Gb/s WDM O-band silicon photonic transceiver sub-assembly.

We demonstrate a 200G capable WDM O-band optical transceiver comprising a 4-element array of Silicon Photonics ring modulators (RM) and Ge photodiodes (PD) co-packaged with a SiGe BiCMOS integrated driver and a SiGe transimpedance amplifier (TIA) chip. A 4×50 Gb/s data modulation experiment revealed an average extinction ratio (ER) of 3.17 dB, with the transmitter exhibiting a total energy efficiency of 2 pJ/bit.