Aramid (Ar), produced from the reaction of aromatic diamines and diacid chloride, was reactively compatibilized with amino-functionalized polystyrene (APS) to explore blend morphology and interfacial cohesion. Two blend systems, Ar/PS and Ar/APS, were investigated over a range of pristine polystyrene (PS) or modified APS ratios. Morphology and thermal and mechanical properties were probed to evaluate the effect of amine units of APS on the compatibility with Ar.
View Article and Find Full Text PDFMultilayer TiO(2)-Ge thin films have been deposited using electron beam evaporation and resistive heating. The thickness of the TiO(2) layers is 20 nm, while the thickness of the Ge layers varies from 2 to 20 nm with a step of 2 nm away from the substrate. These films were characterized by studying their optical, electrical, and structural properties.
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